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EN
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Indium is a malleable metal with a low melting point (157℃). With Sn, Pb, Ag etc., it can form a series low melting point eutectic solders .
Features & Benefits
· Low melting point
· Low vapour pressure
· Favorable ductility and malleability
· Good thermal fatigue properties
· Repeatable welding and reflow soldering at low temperature is available.
· Nice resistance in drop tests
· Superior thermal conductivity
Product Application
Indium has a high thermal conductivity (86W / mK at 85°C). Therefore, it is widely used in thermal management, and the heat generated by electronic components can be effectively eliminated through it.
· Vacuum electronic devices packaging
· Glass packaging
· Ceramic packaging
· Low-temperature superconductive device packaging
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Model
|
|---|
| In51Bi32.5Sn16.5 |
| In66.3Bi33.7 |
| Bi50Pb28Sn22 |
| In52Sn48 |
| Sn50In50 |
| In80Pb15Ag5 |
| In97Ag3 |
| In100 |
| In60Pb40 |
| Sn77.2In20Ag2.8 |
| In50Pb50 |
| Pb60In40 |
|
Solid Line
°C |
Liquidus
℃ |
Eutectic Alloy
℃ |
Density
g/cm3 |
Resistivity
µΩ.m |
Thermal Conductivity
W/m.K |
Thermal Expansion Coefficient
10-6/℃ |
Tensile Strength
Mpa |
|---|---|---|---|---|---|---|---|
| / | / | 60 | 7.88 | 0.522 | / | 22 | 33.44 |
| / | / | 73 | 7.99 | / | / | / | / |
| / | / | 100 | / | / | / | / | / |
| 120 | 122 | / | 7.3 | 0.147 | 34 | 20 | 12 |
| 118 | 125 | / | 7.3 | 0.147 | 34 | 20 | 11.86 |
| 149 | 154 | / | 7.85 | / | / | / | / |
| / | / | 143 | 7.38 | 0.075 | 73 | 22 | 5.5 |
| / | / | 157 | 7.31 | 0.072 | 86 | 29 | 1.88 |
| 174 | 185 | / | 8.52 | 0.246 | 29 | 27 | 28.61 |
| 175 | 187 | / | 7.25 | 0.176 | 54 | 28 | 46.88 |
| 184 | 210 | / | 8.86 | 0.287 | 22 | 27 | 32.2 |
| 197 | 231 | / | 9.3 | 0.331 | 19 | 26 | 34.48 |